Layout Design Interview Question
Advantages and disadvantages of MOSFET
Advantages and Disadvantages of MOSFET Scaling
Back End of the Line (BEOL) CMOS Fabrication Process Steps
Difference between the TTL chips and CMOS chips?
Different Types of IC Packaging
Front End of the Line (FEOL) CMOS Fabrication Process Steps
How does FinFET reduce leakage?
How multiple vias are used to reduce crosstalk?
How the spacing reduces the crosstalk?
MOS capacitance-voltage characteristics
What are the steps involved in semiconductor device fabrication?
What checks are done in Electrical rule check (ERC)
What is Bulk Connection in CMOS?
What is Schematic & Layout Design
What is the odd cycle error in VLSI
Where is FinFET technology used?
Why do we use p substrate in CMOS?
Working of ESD Clamp Circuit in VLSI
